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Découvrez pourquoi choisir un équipement laser microfluidique pour le traitement des plaquettes de semi-conducteurs

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December 16, 2025
Catégorie Connexion: équipement de laboratoire scientifique
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Les étiquettes:
#mètre UV de transmittance #Mètre léger de transmittance #mètre de transmission de la lumière
Bref: Dans cette présentation, nous soulignons les idées de conception clés et comment elles se traduisent par des performances.Voyez comment Microfluidic Laser Equipment utilise un jet d'eau mince comme un cheveu pour guider l'énergie laser pour le traitement des plaquettes de semi-conducteursDécouvrez comment cette méthode hybride de micro-usinage réduit les dommages thermiques, prévient la contamination et améliore la qualité des bords sur des matériaux durs et fragiles comme les plaquettes SiC et GaN.
Caractéristiques Du Produit Connexes:
  • Hybrid micromachining method coupling a thin water jet with a laser beam for precise energy delivery.
  • Total internal reflection guiding mechanism ensures accurate laser beam transmission to the workpiece.
  • Continuous cooling and debris removal during processing for a cleaner, more stable operation.
  • Reduces heat-affected damage, contamination, oxidation, and microcracks in semiconductor materials.
  • Supports various laser wavelengths (1064 nm, 532 nm, 355 nm) and power levels up to 200 W.
  • Configurable nozzle diameters from 30-150 μm using sapphire or diamond materials.
  • High-precision positioning with accuracy up to ±5 μm and repeatability of ±2 μm.
  • Applicable to advanced packaging, wafer dicing, chip drilling, and defect repair processes.
FAQ:
  • What is microjet laser technology?
    Microjet laser technology is a hybrid micromachining process where a thin, high-velocity water jet guides a laser beam using total internal reflection, delivering precise energy to the workpiece while providing continuous cooling and debris removal.
  • What are the key advantages of microjet laser processing versus dry laser processing?
    Key advantages include reduced heat-affected damage, less contamination and redeposition, lower risk of oxidation and microcracks, minimized kerf taper, and improved edge quality on hard and brittle semiconductor materials.
  • Which semiconductor materials are best suited for microjet laser processing?
    It is particularly well-suited for hard and brittle materials like silicon carbide (SiC) and gallium nitride (GaN), as well as silicon wafers, ultra-wide-bandgap materials such as diamond and gallium oxide, and selected advanced ceramic substrates.
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