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Gaufrette de carbure de silicium
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Silicon Carbide Wafer 4inch HPSI 350um Widely Used for AR Glasses

Silicon Carbide Wafer 4inch HPSI 350um Widely Used for AR Glasses

Nom De Marque: ZMSH
Numéro De Modèle: Plaquette Sic HPSI de 4 pouces
MOQ: 10 pièces
Détails De L'emballage: Package personnalisé
Conditions De Paiement: T / t
Les informations détaillées
Lieu d'origine:
CHINE
Certification:
RoHS
Diamètre:
100 ± 0,5 mm
Épaisseur:
350um
Grade:
Démonstration / recherche / qualité de production
Taper:
HPSI
Matériel:
Monocristal de SiC
Couleur:
Transperant
Mettre en évidence:

Une gaufre en carbure de silicium de 4 pouces.

,

Plaquettes de carbure de silicium HPSI

,

plaquettes en carbure de silicium pour verres AR

Description de produit

Silicon Carbide Wafer 4inch HPSI 350um Widely Used for AR Glasses

 

Product Introduction:

 

     Semi-insulating silicon carbide (SiC) wafers are substrates used for producing high-power and high-frequency electronic devices. SiC wafers are semiconductor materials formed by combining silicon and carbon. The electrical resistivity of semi-insulating SiC wafers lies between that of conductors and insulators, whereas ordinary silicon wafers are conductive. They are mainly used in power devices, electronic and optoelectronic applications, and wireless infrastructure. Driven by the surging demand for power electronics, growing attention to energy efficiency, the transition toward clean energy solutions, and substantial public and private investment in SiC manufacturing capacity, the market for semi-insulating SiC wafers is expanding. High-purity semi-insulating silicon carbide (SiC) wafers are key materials used in the manufacture of high-performance radio frequency (RF) devices. They hold significant value in fields such as 5G communications, radar detection, and military applications. With electrical resistivity between that of conductors and insulators, these wafers can effectively support the operation of high-power and high-frequency devices.

 

 

Product Advantages&Applications:

 

High Performance: SiC Wafers are with a wide bandgap (>~2.3 eV), approximately three times that of silicon, SiC enables high breakdown voltage and low power loss.


High Thermal Conductivity: Featuring excellent heat conductivity, SiC wafers serve as an ideal heat dissipation material, effectively addressing device overheating issues.


High Breakdown Electric Field: SiC wafers’ breakdown field strength is significantly higher than that of conventional semiconductor materials (such as silicon), making it suitable for high-voltage device fabrication.


 High Electron Mobility: The high electron saturation velocity contributes to faster device switching speeds.


 Resistance to Harsh Environments: SiC wafers demonstrate outstanding resistance to high temperatures, high voltages, high frequencies, and radiation, making it ideal for use in extreme conditions.

 

Power Electronics: Used in power devices and inverters to improve energy conversion efficiency.

Microwave and RF Devices: Suitable for manufacturing next-generation electronic equipment.

Extreme Environment Applications: Utilized in aerospace, military, and oil exploration fields.

Strategic Industries: Applied in solar energy, automotive manufacturing, semiconductor lighting, and smart grids to reduce energy consumption and minimize device size.

 

Product Parameters:

 

4 inch diameter Silicon Carbide (SiC) Wafer Specification

Grade
Zero MPD
Production

Standard Production
Grade(P
Grade)

Dummy Grade
(D
Grade)
Diameter 99.5 mm~ 100.0 mm
Thickness 4H-N 350 μm±15 μm 350 μm±25 μm
4H-SI 500 μm±15 μm 500 μm±25 μm
Wafer Orientation Off axis : 4.0° toward <1120 > ±0.5° for 4H-N, On axis : <0001>±0.5° for 4H-SI
Resistivity 4H-N 0.015~0.024 Ω·cm 0.015~0.028 Ω·cm
4H-SI 1E10 Ω·cm 1E5 Ω·cm
Primary Flat Orientation {10-10} ±5.0°
Primary Flat Length 32.5 mm ± 2.0 mm
Secondary Flat Length 18.0 mm ± 2.0 mm
Secondary Flat Orientation Silicon face up: 90° CW. from Prime flat ±5.0°
Edge Exclusion 3 mm
LTV/TTV/Bow /Warp ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm
Roughness Polish Ra≤1 nm
CMP Ra≤0.2 nm Ra≤0.5 nm

Silicon Surface Scratches By High Intensity Light
None Cumulative length≤1×wafer diameter
Edge Chips High By Intensity Light None permitted ≥0.2 mm width and depth 5 allowed, ≤1 mm each
Packaging Multi-wafer Cassette Or Single Wafer Container

 

Product Pictures:

Silicon Carbide Wafer 4inch HPSI 350um Widely Used for AR Glasses 0

 

Related Product Recommendation:

2 3 4 6inch Sic Wafer , Silicon Wafer 4H-N/Semi Type SiC Ingots Industrial

 

Silicon Carbide Wafer 4inch HPSI 350um Widely Used for AR Glasses 1

 

Q&A:

 

Q: What is a SiC wafer?

 

A: A SiC wafer — short for silicon carbide wafer — is a type of semiconductor substrate made from silicon carbide (SiC), a compound of silicon and carbon. It’s considered a next-generation material for high-performance and high-efficiency electronic devices, especially power electronics.

 

Q: What is the difference between SI wafer and SiC wafer?

 

A: The difference between Si (silicon) wafers and SiC (silicon carbide) wafers is fundamental to why SiC is driving the next generation of high-performance electronics.

Silicon = Mature, low-cost, ideal for standard low-power electronics.

 

Silicon Carbide (SiC) = Advanced material for high power, high voltage, high temperature, and high efficiency systems.

 

Q: What are the uses of silicon carbide wafers?

 

A: silicon carbide (SiC) wafers are revolutionizing modern electronics because of their exceptional electrical, thermal, and mechanical properties. They’re mainly used in high-power, high-frequency, and high-temperature applications — areas where traditional silicon wafers can’t perform efficiently.